Kingston’s Latest Technology: KHX16000D3T1K3/3GX DDR3 RAM


Kingston’s new HyperX® T1 series features heat spreaders with HTX (HyperX Thermal Xchange) Technology that makes them literally the coolest for any new rig you may be building. This latest technology has a very high-performance which are designed with heavy aluminum extrusions with extended fins and other component technology to keep DRAMs cool and modules ready for performance, gaming and overclocking. Kingston’s KHX16000D3T1K3/3GX is a triple-channel kit of three 128M x 64-bit 1GB (1024MB) DDR3-2000 CL9 SDRAM (Synchronous DRAM) memory modules, based on eight 128M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Each module kit has been tested to run at DDR3- 2000MHz at a latency timing of 9-9-9 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333Mhz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows:

– JEDEC standard 1.5V ± 0.075V Power Supply
– VDDQ = 1.5V ± 0.075V
– 667MHz fCK for 1333Mb/sec/pin
– 8 independent internal bank
– Programmable CAS Latency: 9-9-9-24 @ 1T
– Posted CAS
– Programmable Additive Latency: 0, CL – 2, or CL – 1 clock
– Programmable CAS Write Latency(CWL) = 9(DDR3-1333)
– 8-bit pre-fetch
– Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
– Bi-directional Differential Data Strobe
– Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
– On Die Termination using ODT pin
– Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C
– Asynchronous Reset
– PCB : Height 1.180” (30.00mm), single sided component

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