Archive for the 'Memory' Category
Corsair has just released its latest DDR3 1600 memory module kit, the CMD16GX3M2A1600C9. As part of the DOMINATOR PLATINUM series, this new 16GB (8GBx2) DDR3 1600 memory module kit works at 1.5V with 1600MHz speed and 9-9-9-24 latency. This dual channel DDR3 memory also corresponds to Intel X79 processors, and can adapt to the highest standards of IC chip. The Corsair 16GB CMD16GX3M2A1600C9 is also equipped with a (Dual-Path Heat Exchange) Cooling Technology DHX patented. This unique cooling technology by Corsair efficiently improves the overall performance of the memory module by boosting its cooling performance to make sure that heat is dissipated from both sides of the IC chip and the PCB. The CMD16GX3M2A1600C9 will retail for 16,600 Yen (about $211).
Corsair Vengeance 8GB DDR3 is the latest memory module set to launch today by Links International with a price tag of $81. Codename CML8GX3M1A1600C10 will work at 1.5V with a speed of 1600MHz and 10-10-10-27 latencies. Every Vengeance memory module provides users with outstanding performance and high quality. As part of the VENGEANCE series, Vengeance memory modules are built using carefully selected DRAM to allow excellent overclocking performance and rock solid stability. Corsair 8GB CML8GX3M1A1600C10 DDR3 Memory Module is also equipped with a low-profile heat spreader (31mm in height) and compatible with AMD and Intel platforms.
I’m quite sure that many computer users still haven’t yet experience how fast a DDR3 is when used on a desktop computer or laptop. In my cased I’m using DDR3 modules on my laptop and the difference among DDR1 and DDR2 is significantly fast. So the question is how fast would it be if we will use DDR4 memory? Speaking of this technology, Samsung has just announced the world’s first DDR4 DRAM memory modules, using 30 nanometer class process technology. DDR4 is set to replace DDR3 and bring with it 40% greater energy efficiency. The module makes use of Pseudo Open Drain (POD), a new technology that has been adapted to high-performance graphic DRAM. Transfer rates at 2.133Gbps at a voltage setting of 1.2V and can be max out up to 3.2Gbps on higher voltages. There’s still no information regarding its release date and pricing.
Recently, A-DATA® Technology Co., Ltd., one of the top global manufacturer in high-performance DRAM modules and flash application products has rolled out its latest DDR3 memory, the new XPG DDR3-1600G 8GB Dual Channel Memory Kit. This latest A-DATA technology is designed for gaming aficionados who are using the power of Intel P55 and H55 motherboards for their gaming machine. XPG DDR3 offers the CL9-9-9-24 timing at a voltage of 1.65V and high-powered capacity to optimize the PC performance for ultimate gaming experiences. Furthermore, this latest technology was optimized for 64-bit OS (operating system), DRAM IC is verified by high standard criteria, High quality 6 layers PCB (Printed Circuit Board). Lastly, it is also compatible with DDR3-1333 and DDR3-1066, and has a * SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
OCZ has introduced the new 2.5-inch solid state drive with Indilinx Amigos controller. This latest device named OCZ Onyx SSD has a storage capacity of 32GB. It is packed with MLC (multi-level cell) NAND Flash memory chips, a SATA 3.0 Gbps interface, 64MB of cache, TRIM support, a MTBF of 1.5 million hours, a maximum read and write speeds of 125 MB/s and 70 MB/s, respectively. This latest device is said to be good solution for net books, laptops and personal computer at home.
Transcend has launched its latest technology, the new RDP7 multi-card reader. This latest device is integrated with USB hub and equipped with 3-slot card reader function that can easily hold up to three USB peripherals like USB mouse, USB webcam, and USB flash drive. In addition, it also supports almost all of the trendy formats like SDHC, SD, microSDHC, microSD, Transflash, MMC and many more. Furthermore, it does not require power electricity to run, thus, you can save energy. Lastly, it has also a photo recovery toll software that features a quick and easy access to user interface that shows all of the thumbnail previews of the images that can be recover. It measures 88 X 54 X 10.6 mm in size and weighing about 40 grams.
Kingston’s new HyperX® T1 series features heat spreaders with HTX (HyperX Thermal Xchange) Technology that makes them literally the coolest for any new rig you may be building. This latest technology has a very high-performance which are designed with heavy aluminum extrusions with extended fins and other component technology to keep DRAMs cool and modules ready for performance, gaming and overclocking. Kingston’s KHX16000D3T1K3/3GX is a triple-channel kit of three 128M x 64-bit 1GB (1024MB) DDR3-2000 CL9 SDRAM (Synchronous DRAM) memory modules, based on eight 128M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Each module kit has been tested to run at DDR3- 2000MHz at a latency timing of 9-9-9 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333Mhz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows: